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LEXES – EX 300

Soluzione metrologica compositiva per semiconduttori front-end per nodo 22nm e oltre
Front-end semiconductor compositional metrology solution for 22nm node and beyond.

CAMECA’s EX-300 is a unique LEXES based metrology tool supporting major semiconductor developments since the 90nm node era and following up the integration of the most diverse materials. It accelerates the time-to-market of your logic and memory devices and increases the integrated yield of your high volume production.

The EX-300 benefits from over a decade of experience with LEXES technology in the semiconductor industry: dozens of LEXFAB-300 Shallow Probes have been installed at the top-ten semiconductor fabrication facilities worldwide. The EX-300 is targeted for new challenging applications such as SiGe and HKMG, and it is designed to accelerate the time to market of advanced logic & memory devices while achieving high production yield.

The tool of choice for front-end process issues at 32nm node and beyond
Based on the non-contact, non-destructive LEXES technique – a unique solution for direct measurement of the chemical composition at the surface and near surface – the EX-300 offers a panel of complementary capabilities enlarging the domains of classical metrology to current challenging processes:

  • Ultra shallow implants: Monitoring of low energy, high concentration implants
  • Strained silicon process control: Chemical composition and thickness in epitaxial layers such as B:SiGe and P:SiC, with no limitation in the layer composition
  • HKMG metrology: Both the oxides and the metal are controled by one single EX-300 platform

CAMECA’s EX-300 delivers enhanced long-term stability with excellent vacuum limit. The below graph shows reproducibility over several months for an average As dose of 1.97e15 at/cm2 with a global RSD (1σ) of 0.622%.

Advanced and robust pattern analysis
The EX-300 has been specifically designed to perform metrology of challenging patterned wafers down to 30×30µm pads.
Higher brightness is achieved with the new LaB6 gun, thus ensuring denser small probe. Improved light source and optics and a new digital camera with zooming capabilities enable smooth visual navigation while the new electrostatic chuck secures wafer clamping.

Optimized design and easy tool control for high uptime
The EX-300 delivers 5 to 20% throughput improvements compared to the previous Shallow Probe LEXFAB-300 model (depending on application). Improved ergonomics allow rapid maintenance and thus optimized MTTR. The fully integrated LEXES-Pilot software provides a user-friendly interface as well as reliable factory automation.

Your Laboratory Partner

Since 1998, Media System Lab has focused its attention on Quality Research and Attention to Customer needs

Contact us to learn more about LEXES – EX 300

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